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TG-A6200LC High Performance Thermal Pad
• Great thermal conductivity
• Best for low and medium power applications
• Difficult to be deformed
• Easy to assemble
• One side low tack
Application:
• Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
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