Efficient thermal management is a critical factor for the performance, reliability, and service life of modern electronic systems. Whether in power electronics, e-mobility, telecommunications, or highly compact designs, increasing power densities demand innovative thermal solutions.
Here we present our seven best thermal management products: from ultra-soft thermal pads and high-conductivity hybrid materials to graphite foils and silicone-free thermal pastes. Each product is designed to reliably address specific thermal challenges while simplifying assembly processes and optimizing overall system performance.
TG-AD66
TG-AD66 is the mid-range pad in our innovative Hybrid AD series, designed to bridge the gap between pads and putties. TG-AD66 is an ultra-soft thermal pad that offers the conformability of a putty while maintaining the cleanliness, stability, and ease of use of a pad. It provides a thermal conductivity of 6.5 W/mK and a Shore hardness of 25 Shore 00.
TG-AD75
TG-AD75 helps customers simplify assembly processes, reduce rework and QC inspection time, and extend product service life—without compromising thermal design margins. AD-75 offers the same features as its AD-66 counterpart, but with an even higher thermal conductivity of 7.5 W/mK.
TG-A3500
TG-A3500 is a cost-effective gap pad despite its softness of 35 Shore 00, offering a thermal conductivity of 3.5 W/mK. Thanks to its tacky surface, it conforms well to uneven surfaces and helps maintain low thermal impedance in cost-sensitive designs—without sacrificing performance.
T68
T68 is an ultra-thin, lightweight, highly oriented graphite-polymer film. Its in-plane thermal conductivity reaches up to 1,500 W/mK, making it significantly better than copper in the XY direction. With its flexibility and low thermal resistance, it is a top choice for heat spreading in highly compact designs where space and efficiency are critical. Its excellent electrical conductivity also provides additional EMI shielding.
TG-A1780
TG-A1780 is one of our most thermally advanced pads. It offers our highest thermal conductivity in pad format—an impressive 17.8 W/mK - combined with a softness of 70 Shore 00, delivering an excellent balance of performance and mechanical conformability. It is especially well suited for high-power applications in electric vehicles, telecommunications, and other high-density, high-heat designs.
TG-N909
TG-N909 is a high-performance, silicone-free thermal paste. With a thermal conductivity of 9 W/mK, this single-component, fully cured compound delivers low thermal impedance and outstanding reliability under extreme conditions such as thermal cycling, vibration, and shock. Its silicone-free formulation also minimizes outgassing and degradation, making it ideal for long-life, mission-critical systems and silicone-sensitive applications such as optoelectronics.
TG-A1250
TG-A1250 is our best-selling ultra-soft pad. It combines a thermal conductivity of 12.5 W/mK with a low Shore hardness of 55, providing high thermal performance along with excellent conformability and electrical insulation. Its dielectric breakdown voltage of >10 kV/mm and wide operating temperature range of –50 °C to +180 °C make it a reliable choice for a broad range of applications—from aerospace and electric vehicles to AI, VR, and beyond.
Further information:
For specific products: TG-AD66 / TG-AD75 / TG-A3500 / T68 / TG-A1780 / TG-N909 / TG-A1250 Of course, this is only a small selection of our thermal interface products. Here you can find our full product range: Termal management
“With our broad portfolio of thermal interface materials, we offer the right solution for virtually any application — from cost-sensitive designs to high-performance, mission-critical systems. Whether you need maximum thermal conductivity, exceptional conformability, electrical insulation, or reliable silicone-free performance, our products enable efficient thermal management without compromising on quality, process reliability, or service life. We would be happy to support you in selecting the optimal material for your specific application and help you address thermal challenges sustainably. Please feel free to contact us.