top of page

TG-AD66 Ultra Soft Thermal Pad
• Hohe Wärmeleitfähigkeit
• Geringer thermischer Widerstand
• Gute elektrische Isolierung
Anwendungsbereiche:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
bottom of page