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TG-AD66 Ultra Soft Thermal Pad
TG-AD66 Ultra Soft Thermal Pad

• Hohe Wärmeleitfähigkeit
• Geringer thermischer Widerstand
• Gute elektrische Isolierung

Anwendungsbereiche:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

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