Gap-Filler
Geltec Lamda Gel RE
Dieses Wärmeleitpad absorbiert elektromagnetische Wellen - dank Ferritfüllung.
H48-6 Thermal Conductive Pad
• Very good thermal conductivity
• Soft and high compressibility
• Natural tack
• Easy to assemble
• Very good insulator
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...
H48-6G Thermal Conductive Pad
• Very good thermal conductivity
• Soft and high compressibility
• Natural tack
• Easy to assemble
• Very good insulator
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...
L37-3 Thermal Conductive Pad
• Very good thermal conductivity
• Ultra soft and high compressibility
• Natural tack
• Easy to assemble
• Very good insulator
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...
PC93 / TG-APC93 Non-silicone Thermal Pad
• Non siloxane and oil-bleed
• Ultra soft and great elongation
• Electrical insulation
• Very low thermal impedance
Applications that require no silicone
• Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile
Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,
Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device,
Wireless Hub, DDR ll Module, etc.
TG-A1250LC High Performance Thermal Pad
• Great thermal conductivity Best for low and medium power applications
• Difficult to be deformed
• Easy to assemble
• One side low tack
Application:
• Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
TG-A6200LC High Performance Thermal Pad
• Great thermal conductivity Best for low and medium power applications
• Difficult to be deformed
• Easy to assemble
• One side low tack
Application:
• Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
TG-A9000 Ultra Soft Thermal Pad
Best for high power applications
• High thermal conductivity
• Low thermal resistance
• High compressibility and compliancy
• Good electrical insulation
Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile
Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.
TG-AD30 Ultra Soft Thermal Pad
• Hohe Wärmeleitfähigkeit
• Geringer thermischer Widerstand
• Gute elektrische Isolierung
Anwendungsbereiche:
• Elektronische Komponenten – 5G, Luft- und Raumfahrt, Künstliche Intelligenz (KI), AIoT (KI + Internet der Dinge), AR/VR/MR/XR (Erweiterte, Virtuelle, Gemischte und Erweiterte Realität), Automobilindustrie, Verbrauchergeräte, Datenkommunikation, Elektrofahrzeuge, Elektronische Produkte, Energiespeicherung, Industrie, Beleuchtungsausrüstung, Medizintechnik, Militär, Netzkommunikation, Displays/Panels, Leistungselektronik, Robotik, Server, Smart Home, Telekommunikation usw.
TG-AD66 Ultra Soft Thermal Pad
• Hohe Wärmeleitfähigkeit
• Geringer thermischer Widerstand
• Gute elektrische Isolierung
Anwendungsbereiche:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
TG-APC94 Non-Silicone Thermal Conductive Pad
• Low contact thermal impedance
• Good thermal conductivity
• Silicone free
• Long term stability
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...
TG2030 Ultra Soft Thermal Conductive Pad
• Very good thermal conductivity
• Compliancy - High Compressibility
• Natural Tack
• Low Hardness (Shore 00)
• Low Oil Blead-Long term Stability
• Electrical Insulating
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...
TG4040 Ultra Soft Thermal Conductive Pad
• Good thermal conductivity, Low thermal resistance
• Electrical Insulation
• High compressibility and compliancy
• Increase the performance of electronics
Applications:
• Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.
TG6050 Ultra Soft Thermal Conductive Pad
• Very good thermal conductivity
• Compliancy - High Compressibility
• Natural Tack
• Low Hardness (Shore 00)
• Low Oil Blead-Long term Stability
• Electrical Insulating
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...
Thermal Pad TG-A 3500
• Non oil-bleed
• Ultra soft and great elongation
• Electrical insulation
• Very low thermal impedance
Applications:
• Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile
Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.