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Wärmeleitfolien

GT Series Thermal Pad

• Smooth surface & low contact resistance Usable over a wide temperature range
• Wide temperature range
• Electrical insulation; high breakdown voltage

Usable over a wide temperature range
Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

GT10D Thermal Pad

• Smooth surface & low contact resistance
• Low thermal impedance
• High stabality
• Great reliability

Application:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

L37-3F Thermal Conductive Pad

• Good thermal conductivity
• Ultra soft and high compressibility
• Natural tack
• Easy to assemble
• Good insulator

Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...

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T62 Graphite Sheets

• Ultra high thermal conductivity
• Easy to assemble
Applications:
• Electronic components: IC / CPU / MOS
• LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
• DDR II Module / DVD Applications / Hand-Set applications etc...

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T68 Graphite Sheets

• Excellent thermal conductivity: 1600 W/mk (4x as high as copper, 7x as high as aluminium)
• Lightweight: Specific gravity: 2.3g/cm3
• Flexible and easy to be cut or trimmed
• Low thermal resistance
• Low moisture content: <1%
Applications:
• Smart phones, mobile phone, NB, Tablet PC
• LED backlight, PDP / LCD / OLED display, High power LED • DVC, DVS, PC card

TG-ALC High Performance Thermal Pad

• Great thermal conductivity Best for low and medium power applications
• Difficult to be deformed
• Easy to assemble
• Double sided inherent tack

Application:
• Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

TG-P100 Graphene

• Ultra thin • Low mass
• Available for unventilated design
• No dusting issue

TG-T1000 Thermal Tape

• Good adhesion
• Great reliability
• Cost effective with great performance
• Easy to assemble
• Customization services

Application:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

TG-T1000T Thermal Tape

• Good adhesion (Acrylic PSA)
• Great reliability
• Cost effective with great performance
• Easy to assemble
• Customization services

Application:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

TG-V Series Thermal Phase Change Materials

• Good flow rate over phase change temperature
• Fully filled the gaps of contact surface
• Low thermal impedance

Application:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

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Ti900 Thermally Conductive Insulators

• Insulation Strength
• Low thermal resistance
• Easy to assemble

Applications:
• Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.

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