• Silicone free thermal gel
• Lower contact thermal impedance than thermal pads
• Physical property in between liquid and solid state
• Gap fillers for uneven or irregular surfaces of heat sources and heat sink
• Applicable for dispenser

Application:
• Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.